NettetThree-dimensional FPGAs Three-Dimensional FPGAs – Part II Can Yield Increase with 3D Stacking? Monolithic 3D IC Could Increase Circuit Integration by 1,000x Repair in 3D Stacks: The Path to 100% Yield with No Chip Size Limits IntSim v2.0: An Open-Source Simulator for Monolithic 2D and 3D-ICs Introducing IntSim v2.5 NettetThe integration in 3D-IC can be face-to-face integration or back-to-face integration. 3D-ICs can be classified into two types: 3D stacked ICs - formed by stacking IC chips and interconnecting them using through silicon vias (TSV). TSVs are the basic elements that enable the fabrication of 3D-SICs.
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